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- Copper powder
Super Fine Copper Powder
HXR-Cu 2.5µm
SFR-Cu 5µm
SF-Cu 5µm
SF-Cu 10µm
- Composition
- Copper: >99％
- Manufacturing method
- Water atomization method
- Application example
- Wiring copper paste for terminal electrodes and substrates (HXR-Cu, SFR-Cu, SF-Cu 5µm)
Metal bond material for diamond tools (SF-Cu 10µm)
Typical data
| Product name | Particle size |
Tap density （Mg/m³） |
Surface area （m²/g） |
Particle size distribution(by Microtrac) | Chemical composition | |||
|---|---|---|---|---|---|---|---|---|
|
Accumulative 10% diameter （µm） |
Accumulative 50% diameter （µm） |
Accumulative 90% diameter （µm） |
Maximum diameter （µm） |
O (mass%) |
||||
| HXR-Cu | 2.5µm | 4.4 | 0.5 | 1.4 | 2.5 | 4.1 | 11.0 | 0.2 |
| SFR-Cu | 5µm | 4.8 | 0.3 | 2.4 | 5.2 | 9.9 | 27.1 | 0.1 |
| SF-Cu | 5µm | 4.3 | 0.3 | 2.8 | 5.7 | 9.8 | 26.3 | 0.1 |
| SF-Cu | 10µm | 4.4 | 0.3 | 3.8 | 8.7 | 16.1 | 44.3 | 0.1 |
Copper powder
HP3010-15 -50#+150#
Cu-B -100#
Cu-A -200#
- Composition
- Copper:>99％
- Manufacturing method
- Water atomization method
- Application example
- Wick material for heat pipes (HP3010-15)
Sintered oil-impregnated bearing (Cu-B)
Catalyst for silver refining (Cu-A)
Typical data
|
Product name |
Particle size |
Apparent density (g/cm³) |
Flow rate (s/50g) |
Particle size distribution(mass%) | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| +300µｍ | +180µｍ | +150µｍ | +106µｍ | +75µｍ | +63µｍ | +45µｍ | -45µｍ | ||||
| HP3010-15 | -50#+150# | 2.15～2.45 | ＜35 | ＜0.2 | 14～21 | 16～24 | 46～55 | 8～15 | ＜1 |
＜0.4 |
- |
| Cu-B | -100# | 2.30～2.70 | ＜30 |
- |
0 | ＜0.3 | 5～12 | 20～28 |
15～23 |
23～30 |
18～25 |
| Cu-A | -200# | 2.85～3.30 | - |
- |
0 | 0 | 0 | ＜0.3 | ＜5.0 |
12～21 |
70～85 |