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- Copper flake powder
Copper flake powder
- Composition
- Copper: >99%
- Manufacturing method
- Ball Mill method
- Application example
- Wiring copper paste for terminal electrodes and substrates
Typical data
Product name | Particle size |
Tap density (Mg/m³) |
Surface area (m²/g) |
Particle size distribution(by Microtrac) | Chemical composition | ||||
---|---|---|---|---|---|---|---|---|---|
Accumulative 10% diameter (µm) |
Accumulative 50% diameter (µm) |
Accumulative 90% diameter (µm) |
Maximum diameter (µm) |
O (mass%) |
C (mass%) |
||||
AFS-Cu | 3µm | 5.1 | 0.4 | 1.6 | 3.3 | 6.8 | 21.4 | 0.3 | 0.2 |
AFS-Cu | 7µm | 5.3 | 0.3 | 2.7 | 6.8 | 15.6 | 47.0 | 0.2 | 0.2 |